NA/sigma optimisation strategies for an advanced DUV stepper applied to 0.25 mu m and sub-0.25 mu m critical levels

被引:0
|
作者
deBeeck, MO
Ronse, K
Ghandehari, K
Jaenen, P
Botermans, H
Finders, J
Lilygren, J
Baker, D
Vandenberghe, G
DeBisschop, P
Maenhoudt, M
VandenHove, L
机构
来源
OPTICAL MICROLITHOGRAPHY X | 1997年 / 3051卷
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the results of an NA-sigma optimisation study are reported, carried out experimentally for an advanced ASML PAS5500/300 deep-UV stepper. The work has been primarily focused on a 0.25 and sub-0.25 mu m gate layer in a logic CMOS process. A positive and negative tone resist process have been compared in terms of CD control and line-end shortening. Dry etch effects and across-field behaviour has been taken into account. Furthermore the contact level of the 0.25 mu m process have been optimised. Effects of layer dependent NA-sigma settings on overlay have been studied.
引用
收藏
页码:320 / 332
页数:3
相关论文
共 50 条
  • [41] Process, voltage and temperature compensation of off-chip-driver circuits for sub-0.25-mu m CMOS technology
    Chi, H
    Stout, D
    Chickanosky, J
    TENTH ANNUAL IEEE INTERNATIONAL ASIC CONFERENCE AND EXHIBIT, PROCEEDINGS, 1997, : 279 - 282
  • [42] Evaluation of applied materials' rapid thermal processor using sematech methodologies for 0.25 mu m technology thermal applications .2.
    Nanda, AK
    Riley, TJ
    Miner, G
    Pas, MF
    HossainPas, S
    RAPID THERMAL AND INTEGRATED PROCESSING V, 1996, 429 : 23 - 30
  • [43] HIGH-SPEED POSITIVE X-RAY RESIST SUITABLE FOR PRECISE REPLICATION OF SUB-0.25-MU-M FEATURES
    BAN, H
    NAKAMURA, J
    DEGUCHI, K
    TANAKA, A
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (06): : 3905 - 3908
  • [44] Evaluation of applied materials' rapid thermal processor using sematech methodologies for 0.25 mu m technology thermal applications .1.
    Riley, TJ
    Nanda, AK
    Miner, G
    Pas, MF
    HossainPas, S
    Velo, LA
    RAPID THERMAL AND INTEGRATED PROCESSING V, 1996, 429 : 15 - 22
  • [45] Design and optimization of a low-power and very-high-performance 0.25-mu m advanced PNP bipolar process
    Djezzar, B
    CAS '96 PROCEEDINGS - 1996 INTERNATIONAL SEMICONDUCTOR CONFERENCE, 19TH EDITION, VOLS 1 AND 2, 1996, : 75 - 78
  • [46] Diffusion and electrical properties of boron and arsenic doped poly-Si and poly-GexSi1-x (x similar to 0.3) as gate material for sub-0.25 mu m complementary metal oxide semiconductor applications
    Salm, C
    vanVeen, DT
    Gravesteijn, DJ
    Holleman, J
    Woerlee, PH
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (10) : 3665 - 3673
  • [47] SUB-1-V SUPPLY VOLTAGE GAAS LSI TECHNOLOGY-BASED ON 0.25-MU-M E/D-HJFETS (IS(3)TS)
    HIDA, H
    TOKUSHIMA, M
    MAEDA, T
    ISHIKAWA, M
    FUKAISHI, M
    NUMATA, K
    OHNO, Y
    NEC RESEARCH & DEVELOPMENT, 1995, 36 (01): : 147 - 156
  • [48] Plasma enhanced chemical vapor deposition Si-rich silicon oxynitride films for advanced self-aligned contact oxide etching in sub-0.25 μm ultralarge scale integration technology and beyond
    Kim, JH
    Yu, JS
    Ku, JC
    Ryu, CK
    Oh, SJ
    Kim, SB
    Kim, JW
    Hwang, JM
    Lee, SY
    Kouichiro, I
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2000, 18 (04): : 1401 - 1410
  • [49] 0.35-MU-M PATTERN FABRICATION USING QUARTZ-ETCH ATTENUATE PHASE-SHIFTING MASK IN AN I-LINE STEPPER WITH A 0.50-NA AND A 0.60-SIGMA
    LOONG, WA
    SHY, SL
    LIN, YC
    MICROELECTRONIC ENGINEERING, 1995, 27 (1-4) : 275 - 278
  • [50] SUB-0.25-MU-M ION PROJECTION LITHOGRAPHY (IPL) IN PMMA-BASED AND NOVOLAK-BASED RESIST MATERIALS (RAY-PF, RAY-PN, SAL-603)
    CEKAN, E
    FALLMANN, W
    FRIZA, W
    PASCHKE, F
    STANGL, G
    HUDEK, P
    BAYER, E
    KRAUS, H
    MICROELECTRONIC ENGINEERING, 1992, 17 (1-4) : 241 - 244