NA/sigma optimisation strategies for an advanced DUV stepper applied to 0.25 mu m and sub-0.25 mu m critical levels

被引:0
|
作者
deBeeck, MO
Ronse, K
Ghandehari, K
Jaenen, P
Botermans, H
Finders, J
Lilygren, J
Baker, D
Vandenberghe, G
DeBisschop, P
Maenhoudt, M
VandenHove, L
机构
来源
OPTICAL MICROLITHOGRAPHY X | 1997年 / 3051卷
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the results of an NA-sigma optimisation study are reported, carried out experimentally for an advanced ASML PAS5500/300 deep-UV stepper. The work has been primarily focused on a 0.25 and sub-0.25 mu m gate layer in a logic CMOS process. A positive and negative tone resist process have been compared in terms of CD control and line-end shortening. Dry etch effects and across-field behaviour has been taken into account. Furthermore the contact level of the 0.25 mu m process have been optimised. Effects of layer dependent NA-sigma settings on overlay have been studied.
引用
收藏
页码:320 / 332
页数:3
相关论文
共 50 条
  • [1] Advanced LPCVD BPSG deposition for sub-0.25 mu m microelectronic fabrication
    Ilg, M
    Kirchhoff, M
    Nguyen, S
    PROCEEDINGS OF THE THIRTEENTH INTERNATIONAL CONFERENCE ON CHEMICAL VAPOR DEPOSITION, 1996, 96 (05): : 863 - 868
  • [2] 0.25 mu m multilevel interconnect with DUV processing
    Krisa, WL
    Shaw, SY
    Brennan, K
    Dixit, GA
    Jain, MK
    OPTICAL MICROLITHOGRAPHY X, 1997, 3051 : 352 - 361
  • [3] Fabrication of microstructures for studies of electromigration in sub-0.25 mu m metal interconnections
    Lee, KY
    Hu, CK
    Shaw, T
    Kuan, TS
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1995, 13 (06): : 2869 - 2874
  • [4] Practical implementation of alternating PSM to memory device of sub-0.25 mu m technology
    Ahn, CN
    Kim, HE
    Kim, HB
    Baik, KH
    OPTICAL MICROLITHOGRAPHY IX, 1996, 2726 : 444 - 452
  • [5] Quantitative line edge roughness characterization for sub-0.25 μm DUV lithography
    Kant, A
    Talor, G
    Samarakone, N
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XIII, PTS 1 AND 2, 1999, 3677 : 35 - 42
  • [6] Dry development of sub-0.25 mu m features patterned with 193 nm silylation resist
    Palmateer, SC
    Forte, AR
    Kunz, RR
    Horn, MW
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 1996, 14 (03): : 1132 - 1136
  • [7] Sub-0.25 mu m optical lithography using deep-UV and optical enhancement techniques
    Vandenhove, L
    Ronse, K
    ULSI SCIENCE AND TECHNOLOGY / 1997: PROCEEDINGS OF THE SIXTH INTERNATIONAL SYMPOSIUM ON ULTRALARGE SCALE INTEGRATION SCIENCE AND TECHNOLOGY, 1997, 1997 (03): : 503 - 514
  • [8] A new positive DUV photoresist optimized for 0.25 mu m isolated lines
    Lindsay, T
    Barclay, GG
    Cronin, MF
    Dellaguardia, R
    Conley, W
    Ito, H
    Mori, M
    Hagerty, P
    Sinta, R
    Zydowsky, T
    Thackeray, JW
    MICROELECTRONIC ENGINEERING, 1997, 35 (1-4) : 109 - 112
  • [9] Ultrathin oxide for sub-0.25 mu m technology in silicon IC's: Impact of stacking & nitridation
    Roy, PK
    Ma, Y
    MICROELECTRONIC DEVICE TECHNOLOGY, 1997, 3212 : 61 - 71
  • [10] Characterisation and optimisation of CD control for 0.25 mu m CMOS applications
    Ronse, K
    deBeeck, MO
    Yen, A
    Kim, KH
    VandenHove, L
    OPTICAL MICROLITHOGRAPHY IX, 1996, 2726 : 555 - 563