Influence of Minor Addition of In on Corrosion Resistance of Cu-Based Bulk Metallic Glasses in 3.5% NaCl Solution

被引:1
作者
Pi Jinhong [1 ,2 ]
Pan Ye [1 ]
Wu Jili [1 ]
He Xiancong [2 ]
机构
[1] Southeast Univ, Jiangsu Key Lab Adv Metall Mat, Nanjing 211189, Jiangsu, Peoples R China
[2] Nanjing Inst Technol, Nanjing 211167, Jiangsu, Peoples R China
基金
中国国家自然科学基金;
关键词
copper-based bulk metallic glasses; amorphous materials; potentiodynamic polarization curves; corrosion; FORMING ABILITY; MICRO-ADDITION; MO;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The corrosion resistances of bulk metallic glasses (BMGs) Cu55-xZr37Ti8Inx (x=0 similar to 5, at%) and Cu61-xZr34Ti5Inx (x=0 similar to 3, at%) were investigated in 3.5 wt% NaCl aqueous solution. The electrochemical potentiodynamic polarization curves demonstrate that the addition of indium to copper-based BMGs can significantly enhance the corrosion potential and reduce the corrosion current density, i.e. greatly improves the corrosion resistance. And the value of I-corr, for copper-based BMGs added with indium is lower than those without indium addition, by roughly one order of magnitude. The moderate replacement of copper by indium improves the corrosion resistance further. While the excessive addition of indium reduces the corrosion resistance, resulting from the lack of Zr-rich protective surface film.
引用
收藏
页码:32 / 35
页数:4
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