Stress and impurities in electroplated copper

被引：0

作者：

Brongersma, SH ^{[1
]}

Kerr, E ^{[1
]}

Vervoort, I ^{[1
]}

Richard, E ^{[1
]}

Maex, K ^{[1
]}

机构：

[1] IMEC, B-3001 Louvain, Belgium

来源：

ADVANCED METALLIZATION CONFERENCE 2000 (AMC 2000) | 2001年

关键词：

D O I：

暂无

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Changes in the as-deposited stress state of electroplated Cu layers as a function of plating current and additive concentrations are shown to be directly linked to the incorporation of impurities in the layer. A compressive trend is seen for both decreasing current and increasing additive concentrations due to an increasing incorporation rate A desorption of these impurities from the layer, accompanied by a stress reduction, occurs at just over 100 degreesC during a thermal cycle independent of the deposition parameters.

引用

页码：161 / 165

页数：5

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