Stress and impurities in electroplated copper

被引：0

作者：

Brongersma, SH ^{[1
]}

Kerr, E ^{[1
]}

Vervoort, I ^{[1
]}

Richard, E ^{[1
]}

Maex, K ^{[1
]}

机构：

[1] IMEC, B-3001 Louvain, Belgium

来源：

ADVANCED METALLIZATION CONFERENCE 2000 (AMC 2000) | 2001年

关键词：

D O I：

暂无

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Changes in the as-deposited stress state of electroplated Cu layers as a function of plating current and additive concentrations are shown to be directly linked to the incorporation of impurities in the layer. A compressive trend is seen for both decreasing current and increasing additive concentrations due to an increasing incorporation rate A desorption of these impurities from the layer, accompanied by a stress reduction, occurs at just over 100 degreesC during a thermal cycle independent of the deposition parameters.

引用

页码：161 / 165

页数：5

共 50 条

[21] Effects of organic additives on preferred plane and residual stress of copper electroplated on polyimide
Kim, Jongsoo
Kim, Heesan
MATERIALS CHEMISTRY AND PHYSICS, 2010, 120 (2-3) : 341 - 347
[22] MAGNETIC EFFECTS ON ELECTROPLATED COPPER
TAKEI, H
TAM, C
DASH, J
PLATING AND SURFACE FINISHING, 1983, 70 (11): : 43 - 43
[23] STRESS-INDUCED PIPE DIFFUSION OF SUBSTITUTIONAL IMPURITIES IN COPPER
OREN, EC
BAUER, CL
JOURNAL OF METALS, 1965, 17 (09): : 1053 - &
[24] Segregation of organic impurities in thin electroplated Cu metallizations
Stangl, Marcel
Acker, Joerg
Hoffmann, Volker
Gruner, Wolfgang
Wetzig, Klaus
MICROCHIMICA ACTA, 2006, 156 (1-2) : 159 - 162
[25] Segregation of organic impurities in thin electroplated Cu metallizations
Marcel Stangl
Jörg Acker
Volker Hoffmann
Wolfgang Gruner
Klaus Wetzig
Microchimica Acta, 2006, 156 : 159 - 162
[26] Simulation of texture development caused stress build-up in electroplated copper lines
Ceric, H.
Hollauer, Ch.
Selberherr, S.
IPFA 2006: PROCEEDINGS OF THE 13TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2006, : 359 - +
[27] Fatigue strength of electroplated copper thin films under uni-axial stress
Murata, Naokazu
Tamakawa, Kinji
Suzuki, Ken
Miura, Hideo
2008 EMAP CONFERENCE PROCEEDINGS, 2008, : 41 - 44
[28] Measurement of Young's modulus and residual stress of copper film electroplated on silicon wafer
Zhou, Y
Yang, CS
Chen, JA
Ding, GF
Ding, W
Wang, L
Wang, MJ
Zhang, YM
Zhang, TH
THIN SOLID FILMS, 2004, 460 (1-2) : 175 - 180
[29] DIMENSIONAL INSTABILITY IN ELECTROPLATED COPPER MIRRORS
CUTLER, RL
HOGAN, BM
PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS, 1983, 380 : 55 - 60
[30] MECHANISM FOR ADHESION OF ELECTROPLATED COPPER TO POLYPROPYLENE
PERRINS, LE
PETTETT, K
PLASTICS & POLYMERS, 1971, 39 (144): : 391 - &

← 1 2 3 4 5 →