Texture of electroplated copper film under biaxial stress

被引：12
|
作者：
Hong, Bo [1 ]
Jiang, Chuan-hai [1 ]
Wang, Xin-jian [1 ]
机构：
[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Shanghai 200240, Peoples R China
来源：
MATERIALS TRANSACTIONS | 2006年 / 47卷 / 09期
关键词：
electroplated copper film; X-ray diffraction; texture; stress;
D O I：
10.2320/matertrans.47.2299
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The stresses and the textures of electroplated copper films were studied using the X-ray diffraction analysis. The results show that the stresses in the films are always tensile. The films have (110) fiber texture at different thickness from 8 to 60 pm. From strain energy minimization point of view, the grains with (110) orientation should be favorable in these films. A further planar texture on top of the fiber texture was developed. It could be explained by elastic anisotropy at different orientation in grain.
引用
收藏
页码：2299 / 2301
页数：3
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