The effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate

被引：0
|
作者：
Harcuba, P. [1 ]
Janecek, M. [1 ]
Slamova, M. [2 ]
机构：
[1] Charles Univ Prague, Dept Phys Mat, Prague 12116, Czech Republic
[2] Res Inst Met Ltd, Panenske Brezany 25070, Odolena Voda, Czech Republic
来源：
KOVOVE MATERIALY-METALLIC MATERIALS | 2009年 / 47卷 / 01期
关键词：
lead-free solders; intermetallic layer formation; Sn-Cu alloys; Cu substrate; FLUIDITY LENGTH; SN-3.5AG;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The influence of Cu and Ni additions on the morphology of the intermetallic compounds (IMC) formed at the interface of the liquid Sn-Cu solder and the Cu substrate has been studied. At low Cu concentrations only a thin IMC layer is formed which remains almost unchanged in time and the substrate is dissolving quickly. Ni additions significantly accelerate the growth kinetics of the IMC layer, prevent the formation of a Cu3Sn layer and reduce the rate of substrate dissolution.
引用
收藏
页码：25 / 29
页数：5
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