共 50 条
- [21] Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 63 - 69
- [24] Spectroscopic ellipsometry and ellipsometric porosimetry studies of CVD low-k dielectric films PHYSICA STATUS SOLIDI C - CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 5, NO 5, 2008, 5 (05): : 1253 - +
- [27] Deposition of low-k dielectric films using trimethylsilane PROCEEDINGS OF THE SYMPOSIA ON ELECTROCHEMICAL PROCESSING IN ULSI FABRICATION I AND INTERCONNECT AND CONTACT METALLIZATION: MATERIALS, PROCESSES, AND RELIABILITY, 1999, 98 (06): : 145 - 152
- [29] Ultra low-k dielectric mechanical property characterization 2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3, 2008, : 714 - +
- [30] Solvent diffusion in porous low-k dielectric films MATERIALS, TECHNOLOGY AND RELIABILITY FOR ADVANCED INTERCONNECTS AND LOW-K DIELECTRICS-2003, 2003, 766 : 229 - 234