EFFECT OF THERMAL TREATMENT ON FERMENTATIVE CAPACITY OF OAT, CORN, AND SORGHUM FLOURS FOR USAGE IN WHEAT FLOUR SUBSTITUTION

An important part of the baking process is the fermentation step. The aim of this research was to evaluate the effect of heat treatment (80, 100, or 130 degrees C) on the fermentative capacity of oat (HA), corn (HM) and sorghum (HS) flours when used in the substitution of wheat flour (HT) at levels of 10 or 20 %. The distribution of particle size, water holding capacity (CRA), viscosity profile of flours using RVA (Rapid Visco Analyser), and the fermentative capacity (measured as dough volume) were determined after one hour of fermentation. The CRA was favored with the use of thermally treated (100 degrees C) 20 % HA. Heat-treatment of flours affected viscosity parameters such as pasting temperature, peak, and final viscosity. These effects were more noticeable when subjected at 130 degrees C. The fermentative capacity considerably improved when 20 % HA (163.93 cm(3)) was treated at 100 degrees C, even higher than that obtained by HT (136.32 cm(3)). The use of 10 % HM, and HS treated at 130 degrees C also favored this parameter, however, not at the level reached by HT.