Wafer fusion: Materials issues and device results

被引：113
|
作者：
Black, A
Hawkins, AR
Margalit, NM
Babic, DI
Holmes, AL
Chang, YL
Abraham, P
Bowers, JE
Hu, EL
机构：
[1] Dept. of Elec. and Comp. Engineering, University of California, Santa Barbara
来源：
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS | 1997年 / 3卷 / 03期
关键词：
detectors; optical fiber communication; semiconductor device bonding; semiconductor device fabrication; semiconductor heterojunctions; semiconductor lasers;
D O I：
10.1109/2944.640648
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A large number of novel devices have been recently demonstrated using wafer fusion to integrate materials with different lattice constants. In many cases, devices created using this technique have shown dramatic improvements over those which maintain a single lattice constant. We present device results and characterizations of the fused interface between several groups of materials.
引用
收藏
页码：943 / 951
页数：9
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