1/f noise in deep submicron CMOS technology for RF and analogue applications

被引:1
作者
Mercha, A [1 ]
Simoen, E [1 ]
Decoutere, S [1 ]
Claeys, C [1 ]
机构
[1] IMEC, B-3001 Louvain, Belgium
来源
NOISE IN DEVICES AND CIRCUITS II | 2004年 / 5470卷
关键词
low frequency noise; mixed signal SOC; high-K gate stacks; gate leakage current; substrate bias; processing modules; noise reduction techniques;
D O I
10.1117/12.546962
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
As further enhanced functionalities of mobile equipment are predicted, the development of a CMOS technology that provides low-power, high-speed, and low-noise performance has become an urgent and hot issue. For these application driven technologies the complexity must be tackled at different levels to insure the optimisation of the area, the power consumption, the speed and the reliability. Therefore this paper present a review of the solutions implemented at different levels from system down to technology in order to reduce the contribution of the low frequency noise. These achievements are illustrated by experimental results from literature and are inserted in the general context of system design strategies for reducing the 1/f noise contribution. In a first part dedicated to high-level system and circuit design, we introduce the noise reduction by switching techniques and the methodology for including the noise dispersion in scaled devices for the early design of analogue/RF circuits. In the second part the 1/f noise is tackled at its origins i.e. the choice of the gate oxide and other critical process steps.
引用
收藏
页码:193 / 207
页数:15
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