In situ scanning tunneling microscopy study of the intergranular corrosion of copper.

被引：35
|
作者：
Martinez-Lombardia, E. [1 ]
Lapeire, L. [2 ]
Maurice, V. [3 ]
De Graeve, I. [1 ]
Verbeken, K. [2 ]
Klein, L. H. [3 ]
Kestens, L. A. I. [2 ]
Marcus, P. [3 ]
Terryn, H. [1 ]
机构：
[1] Vrije Univ Brussel, Res Grp Electrochem & Surface Engn, B-1050 Brussels, Belgium
[2] Ghent Univ UGent, Dept Mat Sci & Engn, B-9052 Ghent, Belgium
[3] Ecole Natl Super Chim Paris, Lab Physicochim Surfaces, CNRS UMR Chim ParisTech 7045, F-75005 Paris, France
来源：
ELECTROCHEMISTRY COMMUNICATIONS | 2014年 / 41卷
关键词：
ECSTM; Copper; Grain boundary; Corrosion; GRAIN-BOUNDARY; STM; DEFORMATION; TEMPERATURE; ELECTRODES; CU(111);
D O I：
10.1016/j.elecom.2014.01.007
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Electrochemical scanning tunneling microscopy is proved to be a powerful tool for providing valuable topographic information to study in situ the local corrosion properties of polycrystalline materials. It was applied to analyze the susceptibility to intergranular corrosion of different types of grain boundaries of microcrystalline copper in HCl and combined with electron backscatter diffraction to link the observed corrosion differences to a specific type of grain boundary. The superior resistance to intergranular corrosion of coherent twin boundaries over random grain boundaries is demonstrated. (C) 2014 Elsevier B.V. All rights reserved.
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页码：1 / 4
页数：4
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