Method for extracting series resistance in MOS devices using Fowler-Nordheim plot

被引:14
作者
Miranda, E [1 ]
机构
[1] Univ Autonoma Barcelona, Dept Elect Engn, E-08193 Barcelona, Spain
关键词
D O I
10.1049/el:20045581
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new method for determining the series resistance affecting the tunnelling current in MOS devices is presented. The proposed approach consists of considering the effect of the potential drop associated with this resistance on the Fowler-Nordheim tunnelling expression. The resistance is found by forcing the highest possible linearity of the Fowler-Nordheim plot.
引用
收藏
页码:1153 / 1154
页数:2
相关论文
共 8 条
[1]   Determination of the Fowler-Nordheim tunneling parameters from the Fowler-Nordheim plot [J].
Chiou, YL ;
Gambino, JP ;
Mohammad, M .
SOLID-STATE ELECTRONICS, 2001, 45 (10) :1787-1791
[2]  
HU D, 1996, SOLID STATE ELECT, V41, P513
[3]   FOWLER-NORDHEIM TUNNELING INTO THERMALLY GROWN SIO2 [J].
LENZLINGER, M ;
SNOW, EH .
JOURNAL OF APPLIED PHYSICS, 1969, 40 (01) :278-+
[4]   Complete method for Ebd correction by series resistance characterization [J].
Monroe, DK ;
Swanson, SE .
1998 IEEE INTERNATIONAL INTEGRATED RELIABIILTY WORKSHOP FINAL REPORT, 1998, :33-38
[5]   SERIES RESISTANCE EFFECTS IN THIN OXIDE CAPACITOR EVALUATION [J].
PIO, F ;
RAVAZZI, L ;
RIVA, C .
IEEE ELECTRON DEVICE LETTERS, 1992, 13 (10) :544-546
[6]   Series resistance and oxide thickness spread influence on Weibull breakdown distribution: New experimental correction for reliability projection improvement [J].
Roy, D ;
Bruyere, S ;
Vincent, E ;
Monsieur, F .
MICROELECTRONICS RELIABILITY, 2002, 42 (9-11) :1497-1500
[7]   Temperature dependence of the electron affinity difference between Si and SiO2 in polysilicon (n+)-oxide-silicon (p) structures:: Effect of the oxide thickness [J].
Salace, G ;
Hadjadj, A ;
Petit, C ;
Jourdain, M .
JOURNAL OF APPLIED PHYSICS, 1999, 85 (11) :7768-7773
[8]   HOLE INJECTION SIO2 BREAKDOWN MODEL FOR VERY-LOW VOLTAGE LIFETIME EXTRAPOLATION [J].
SCHUEGRAF, KF ;
HU, CM .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1994, 41 (05) :761-767