Junction Temperature Measurement Method for SiC Bipolar Junction Transistor Using Base-Collector Voltage Drop at Low Current

被引:19
作者
Shi, Bangbing [1 ]
Feng, Shiwei [1 ]
Zhang, Yamin [1 ]
Bai, Kun [1 ]
Xiao, Yuxuan [1 ]
Shi, Lei [2 ]
Zhu, Hui [1 ]
Guo, Chunsheng [1 ]
机构
[1] Beijing Univ Technol, Fac Informat Technol, Beijing 100124, Peoples R China
[2] Shanghai Second Polytech Univ, Coll Engn, Shanghai 201209, Peoples R China
基金
中国国家自然科学基金; 北京市自然科学基金;
关键词
Junction temperature; silicon carbide bipolar junction transistor (SiC BJT); turn-OFF process; SENSITIVE ELECTRICAL PARAMETERS; POWER MOSFETS; IR CAMERA; RELIABILITY;
D O I
10.1109/TPEL.2019.2894346
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper proposes an electrical method for estimation of the vertical junction temperature of silicon carbide bipolar junction transistors (SiC BJTs). This measurement method is based on measurement of the base-collector voltage (V-BC) drop at a low current (V-BC((low))) during the turn-oFF process. This voltage shows both good sensitivity and linearity with respect to temperature. The traditional temperature-sensitive electrical parameter V-BE((low)) (i.e., the base-emitter voltage at a low current) and an infrared camera are used to compare the characteristics of V-BC((low)). The results show that use of V-Bc(low) provides more accurate junction temperature and thermal resistance measurement results, which can then be used to extract the vertical junction temperature of the SiC BJT under test.
引用
收藏
页码:10136 / 10142
页数:7
相关论文
共 32 条
  • [1] [Anonymous], P PCIM EUR INT EXH C
  • [2] Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters-A Review
    Avenas, Yvan
    Dupont, Laurent
    Khatir, Zoubir
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2012, 27 (06) : 3081 - 3092
  • [3] Azzopardi S., 2011, P 2011 14 EUR C POW, P1
  • [4] IR Camera Validation of IGBT Junction Temperature Measurement via Peak Gate Current
    Baker, Nick
    Dupont, Laurent
    Munk-Nielsen, Stig
    Iannuzzo, Francesco
    Liserre, Marco
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2017, 32 (04) : 3099 - 3111
  • [5] Improved Reliability of Power Modules A Review of Online Junction Temperature Measurement Methods
    Baker, Nick
    Liserre, Marco
    Dupont, Laurent
    Avenas, Yvan
    [J]. IEEE INDUSTRIAL ELECTRONICS MAGAZINE, 2014, 8 (03) : 17 - 27
  • [6] Beczkowski S, 2013, 2013 15 EUR C POW EL, P1
  • [7] BLACKBURN DL, 1975, IEEE T ELECTRON DEV, P142
  • [8] Investigation Into IGBT dV/dt During Turn-Off and Its Temperature Dependence
    Bryant, Angus
    Yang, Shaoyong
    Mawby, Philip
    Xiang, Dawei
    Ran, Li
    Tavner, Peter
    Palmer, Patrick R.
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2011, 26 (10) : 3019 - 3031
  • [9] A study of SiC Power BJT performance and robustness
    Castellazzi, A.
    Takuno, T.
    Onishi, R.
    Funaki, T.
    Kimoto, T.
    Hikihara, T.
    [J]. MICROELECTRONICS RELIABILITY, 2011, 51 (9-11) : 1773 - 1777
  • [10] Chen H., 2006, 3rd IET International Conference on Power Electronics, Machines and Drives (PEMD 2006), P440, DOI 10.1049/cp:20060147