共 17 条
[5]
Fabrication and electrical performance of through silicon via interconnects filled with a copper/carbon nanotube composite
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JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,
2015, 33 (02)
[9]
Development of seed layer for electrodeposition of copper on carbon nanotube bundles
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,
2015, 33 (02)