Smart sensor multi-chip module with direct-chip-attached Micro-Electro-Mechanical System (MEMS) device

Single Micro-Electro-Mechanical System (MEMS)-type sense rs have been used for a variety of automotive and medical applications. However, there has been very little activity in the area of multisensor systems. Boeing is developing a MEMS multisensor system suitable for aerospace applications, including the hardware, firmware, and software necessary to run such a system, in this paper, we report the development of a smart sensor multi-chip module (MCM) containing MEMS-based pressure transducers. The module contains a bare MEMS device, and a CMOS Analog Signal Processor ASIC, an EEPROM and a number of passives. The MCM-D substrate was fabricated on oxidized silicon using copper as conductor and photo-sensitive polyimide as dielectric material Assembly of the module was conducted by utilizing various microelectronic interconnection techniques. The MEMS device was bonded using direct-chip-attachment technique (flip chip) to minimize the height. Finally silicone molding was applied to the module for environmental protection. Functionality was tested by measuring electrical responses as a function of pressure and temperature.