共 25 条
- [6] Jiang JK, 2018, IEEE SOI3DSUB MICRO
- [7] Ultra-fine Pitch 3D Integration Using Face-to-Face Hybrid Wafer Bonding Combined with a Via-Middle Through-Silicon-Via Process [J]. 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 1179 - 1185