Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications

被引：0

作者：

Linz, Torsten ^{[1
]}

Vieroth, Rene ^{[1
]}

Dils, Christian ^{[1
]}

Koch, Mathias ^{[1
]}

Braun, Tanja ^{[1
]}

Becker, Karl-Friedrich ^{[1
]}

Kallmayer, Christine ^{[1
]}

Hong, Soon-Min ^{[2
]}

机构：

[1] Fraunhofer Inst Reliabil & Microintegrat IZM, Gustav Meyer Allee 25, D-13355 Berlin, Germany

[2] Samsung Elect Co Ltd, Fundamental Technol Team, Suwon, South Korea

来源：

SMART TEXTILES | 2009年 / 60卷

关键词：

electronics in textiles; textile wiring and interconnections; embroidered interconnections; connectors; packaging; hot melt encapsulation; transfer molding; reliability standards and tests;

D O I：

暂无

中图分类号：

TB3 [工程材料学]; TS1 [纺织工业、染整工业];

学科分类号：

0805 ; 080502 ; 0821 ;

摘要：

This document explains different approaches to integrating electronics in textiles. It discusses reliability standards and tests for electronics in textiles. Encapsulation technologies are evaluated concerning their applicability in textile integrated electronics. Furthermore a specific assembly with embroidered wiring and embroidered interconnections has been developed and improved. Two different encapsulation technologies have been developed for this assembly. Standardized tests have been carried out to assess the reliability of the assembly and its encapsulations. Finally the achievements are critically discussed.

引用

页码：85 / +

页数：3

共 17 条

[1] ALMAHFUDH R, 2008, INT PIR SMART FABR C
[2] BRAUN T, 2000, HOTMELT ENCAPSULATIO
[3] BRAUN T, 2005, P ESREF 2005 ARC FRA
[4] Design for wearability
Gemperle, F
Kasabach, C
Stivoric, J
Bauer, M
Martin, R
[J]. SECOND INTERNATIONAL SYMPOSIUM ON WEARABLE COMPUTERS - DIGEST OF PAPERS, 1998, : 116 - 122
[5] KAASJAGER A, 2008, COMMUNICATION MAY
[6] KALLMAYER C, 2003, EL COMP TECHN C NEW
[7] LEE JB, 2005, IEEE T ELECT DEVIVES, V52
[8] LINZ C, 2006, IEEE BSN INT WORKSH
[9] LINZ T, 2005, IEEE ISWC INT S WEAR
[10] Linz T, 2005, NEW INTERCONNECTION

← 1 2 →