CMOS-MEMS gyroscope using integrated diode-rings as interface circuits

被引:0
作者
Wang, Jia [1 ]
Qian, Liang [1 ]
Yan, Guizhen [1 ]
机构
[1] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China
来源
2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1-4 | 2008年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents an interface circuit for CMOS-MEMS gyroscope using integrated diode-rings. A brief introduction for the CMOS-MEMS integration technology [1] using high-ratio isolation trench will be introduced first. The integration system contains a Z-axis capacitive bulk silicon gyroscope and an interface circuits using diode-ring doing the first demodulation. A detailed analysis for the integrated diode-ring both theoretically and through simulation is given. The designed circuits including diode-rings and the compensation circuits for the mismatch of the gyroscope comb capacitances are implemented in 1.2-um 2P3M standard CMOS process. The integrated circuits were measured and the result indicated that the performance of the integrated interface circuits for gyroscope is greatly improved compared to that built by PCB.
引用
收藏
页码:2424 / 2427
页数:4
相关论文
共 5 条
  • [1] IYER SV, 2003, THESIS CMU
  • [2] *TAK M4TSUO, 2006, STUD DIOD BRID TYP C
  • [3] WANG J, 2006, AS PAC C TRANSD MICR
  • [4] Zhu Y, 2004, 2004: 7TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUITS TECHNOLOGY, VOLS 1- 3, PROCEEDINGS, P1892
  • [5] ZHU Y, 2005, 13 INT C SOL SENS AC