The organic low-k materials microstructure study

被引:1
|
作者
Du, AY [1 ]
Tung, CH [1 ]
Lu, D [1 ]
Gui, D [1 ]
Chow, YF [1 ]
机构
[1] Inst Microelect, Singapore 117685, Singapore
来源
PROCEEDINGS OF THE 9TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS | 2002年
关键词
D O I
10.1109/IPFA.2002.1025646
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:179 / 182
页数:4
相关论文
共 50 条
  • [31] Low-k dielectric family introduced by SBA Materials
    Garrou, Philip
    SOLID STATE TECHNOLOGY, 2010, 53 (10) : 10 - 11
  • [32] Low-k materials for DRAM: Characterization and integration challenges
    Cigal, JC
    Thies, A
    Klipp, A
    Advanced Metallization Conference 2005 (AMC 2005), 2006, : 239 - 243
  • [33] Packaging assessment of porous ultra low-k materials
    Rasco, M
    Mosig, K
    Ling, JM
    Elenius, P
    Augur, R
    PROCEEDINGS OF THE IEEE 2002 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2002, : 113 - 115
  • [34] Thermomechanical Property Characterization of Ultra Low-k Materials
    Zhao, Jie-Hua
    Gupta, Vikas
    Mortensen, Clay D.
    Lu, Kuan-Hsun
    Edwards, Darvin R.
    Johnson, David C.
    Ho, Paul S.
    STRESS-INDUCED PHENOMENA IN METALLIZATION, 2009, 1143 : 87 - +
  • [35] Optical functions of low-k materials for interlayer dielectrics
    Postava, K
    Yamaguchi, T
    JOURNAL OF APPLIED PHYSICS, 2001, 89 (04) : 2189 - 2193
  • [36] Plasma Damage Recovery of Organic Low-k Material
    Hirai, Mihoko
    Tada, Masahiro
    Akiyama, Yoshihito
    Koga, Kazuhiro
    JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2011, 24 (03) : 263 - 266
  • [37] Nanomechanical Characterization and Metrology for Low-k and ULK Materials
    Hangen, Ude D.
    Yeap, Kong-Boon
    Vodnick, David
    Zschech, Ehrenfried
    Li, Han
    Vlassak, Joost
    FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2011, 2011, 1395
  • [38] Some aspects of the materials science of low-K integration
    McGahay, V
    MATERIALS, TECHNOLOGY AND RELIABILITY FOR ADVANCED INTERCONNECTS AND LOW-K DIELECTRICS-2003, 2003, 766 : 47 - 58
  • [39] Effect of microstructure and dielectric materials on stress-induced damages in damascene Cu/low-k interconnects
    Joo, YC
    Paik, JM
    Jung, JK
    THIN FILMS STRESSES AND MECHANICAL PROPERTIES XI, 2005, 875 : 301 - 312
  • [40] Electronic materials - Shipley enters low-K market
    Hunter, D
    CHEMICAL WEEK, 2001, 163 (23) : 30 - 30