Characteristics and reliability of no-flow underfills for solder bumped flip chips on low cost substrates

被引：0

作者：

Lau, JH ^{[1
]}

Chang, C ^{[1
]}

Chen, CC ^{[1
]}

机构：

[1] Express Packaging Syst Inc, Palo Alto, CA 94303 USA

来源：

1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS | 1999年 / 3906卷

关键词：

no-flow underfill; flip chip; reliability; physical and mechanical properties;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Solder bumped flip chips on low cost substrates with three different epoxy-based no-clean flux liquid-like no-flow underfills are presented in this study. Important material and process parameters such as curing temperature and time, thermal coefficient of expansion, storage modulus, loss modulus, tan delta, glass transition temperature, moisture uptake, solder reflow, and post curing are discussed. Also, cross-sections are examined for a better understanding of the effects of these no-flow underfill materials on the interconnects of the flip chip assemblies. Shear and thermal-cycling tests and results of these flip chip assemblies are reported and analyzed.

引用

页码：439 / 449

页数：11

共 29 条

[1]

ANDERSON B, 1999, P NEPCON WEST, P135

[2]

CRANE L, 1999, P NEPCON WEST, P144

[3] The no-flow fluxing underfill adhesive for low cost, high reliability flip chip assembly [J].

DeBarros, T ;

Neathway, P ;

Chu, QY .

49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, :955-960

[4]

ERICKSON M, 1997, ELECT PACKAGING FEB, P81

[5]

GAMOTO D, 1996, IPCTP1098

[6] Low cost flip chip processing and reliability of fast-flow, snap-cure underfills [J].

Houston, PN ;

Baldwin, DF ;

Deladisma, M ;

Crane, LN ;

Konarski, M .

49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, :61-70

[7] Study of encapsulating system for diversified area bump packages [J].

Ito, S ;

Kuwamura, M ;

Sudo, S ;

Mizutani, M ;

Fukushima, T ;

Noro, H ;

Akizuki, S ;

Prabhu, A .

47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, :46-53

[8] A novel flip chip technology using non-conductive resin sheet [J].

Ito, S ;

Mizutani, M ;

Noro, H ;

Kuwamura, M ;

Prabhu, A .

48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, :1047-1051

[9]

LAU HH, 1998, J ELECTRON MANUF, V8, P151

[10] Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device [J].

Lau, J ;

Chang, C ;

Chen, R .

JOURNAL OF ELECTRONICS MANUFACTURING, 1997, 7 (04) :269-277

← 1 2 3 →