Optimization of SiON/SiOx structures fabrication process for optical waveguides

被引:2
作者
Podlucky, Lubos [1 ]
Vojs, Marian [1 ]
Chovan, Jozef [2 ]
Rehacek, Vlastimil [1 ]
Kovac, Jaroslav [1 ]
Uherek, Frantisek [2 ]
机构
[1] Slovak Univ Technol Bratislava, Fac Elect Engn & Informat Technol, Bratislava, Slovakia
[2] Int Laser Ctr, Bratislava, Slovakia
来源
PROCEEDINGS OF THE 2020 30TH INTERNATIONAL CONFERENCE RADIOELEKTRONIKA (RADIOELEKTRONIKA) | 2020年
关键词
waveguide; IMWP; ICP/RIE; PECVD; silicon oxynitride; PLASMA;
D O I
10.1109/radioelektronika49387.2020.9092431
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have investigated the deposition and etching process of silicon oxynitride (SiON) films for optical waveguides on silicon wafer. SiON films were deposited using plasma-enhanced chemical vapor deposition (PECVD) system. Thickness, uniformity and refractive index was measured by micro-spot spectroscopic reflectometry and confirmed by ellipsometry. Aluminum (Al) mask was fabricated for etching purpose using lift-off process. SiON films were etched in low pressure inductively coupled plasma - reactive ion etching (ICP-RIE) chamber using CF4 gas. The effect of oxygen (O-2) flow rate and source power on etch rate and profile of SiON waveguide was investigated. Scanning electron microscope (SEM) has been used to study the overall structure quality of SiON optical waveguide core. Deposition of SiOx cladding layer was also investigated. SiOx cladding layer was deposited using PECVD system. We investigated the impact of total gas flow rate, N2O/SiH4 ratio and power on the refractive index, growth rate, and uniformity of thickness of the deposited SiOx layer. Micro-trenching occurred in all cases, and their variation was explained by combination of variations in the plasma density and profile angles. The SiO2 cladding layer deposited with N2O/SiH4 ratio of 8,353, total gas flow rate of 1000 sccm and power P = 100W yielded the best results in terms of refractive index.
引用
收藏
页码:186 / 190
页数:5
相关论文
共 12 条
[1]   PLASMA-ENHANCED CHEMICAL VAPOR-DEPOSITION OF LOW-LOSS SION OPTICAL WAVE-GUIDES AT 1.5-MU-M WAVELENGTH [J].
BRUNO, F ;
DELGUIDICE, M ;
RECCA, R ;
TESTA, F .
APPLIED OPTICS, 1991, 30 (31) :4560-4564
[2]  
Byungwhan K., PLASMA ETCHING SILIC
[3]  
Chovan J., 2017, DESIGN FABRICATION C
[4]   Aspect ratio independent etching of dielectrics [J].
Hwang, GS ;
Giapis, KP .
APPLIED PHYSICS LETTERS, 1997, 71 (04) :458-460
[5]  
Integrated circuit engineering Corp, ADV SEM FABR HDB
[6]   Integrated microwave photonics [J].
Marpaung, David ;
Roeloffzen, Chris ;
Heideman, Rene ;
Leinse, Arne ;
Sales, Salvador ;
Capmany, Jose .
LASER & PHOTONICS REVIEWS, 2013, 7 (04) :506-538
[7]  
Melati D, 2014, UNIFIED APPROACH RAD
[8]  
NGUYEN SV, 1991, J ELECTROCHEM SOC, V138, P1112, DOI 10.1149/1.2085726
[9]   INTEGRATED-OPTICS BASED ON SILICON OXYNITRIDE THIN-FILMS DEPOSITED ON SILICON SUBSTRATES FOR SENSOR APPLICATIONS [J].
PETERS, D ;
FISCHER, K ;
MULLER, J .
SENSORS AND ACTUATORS A-PHYSICAL, 1991, 26 (1-3) :425-431
[10]  
Roosmalen A.J., DRY ETCHING FOR VLSI