Three-dimensional visualization of multilayered assemblies using X-ray laminography

被引:12
作者
Kalukin, AR
Sankaran, V
机构
[1] Center for Integrated Electronics and Electronics Manufacturing, Rensselaer Polytechnic Institute, Troy, NY
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1997年 / 20卷 / 03期
关键词
artifacts; image reconstruction; imaging; inspection; laminography; metrology; microelectronics; solder joints; 3-D visualization; x rays;
D O I
10.1109/95.623031
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The imaging technique of X-ray laminography is useful for studying defects in ball grid array, gull-wing and J-lead solder joints, In this process, X-ray images are made to depict cross-sectional planes in multilayered assemblies. It is desirable to be able to create a three-dimensional (3-D) visualization of the assembly by stacking a succession of laminographic cross sections of neighboring planes, In the past this has not been possible for highly layered assemblies because the images contain inherent blurring, which causes the signal-to-noise ratio for a 3-D reconstruction to be extremely poor, This article explains a technique for reconstructing accurate 3-D visualizations of assemblies based upon a small number of laminographic images, Experimental results are described that show that this technique is sensitive to small defects in metallic objects such as ball grid array (BGA) joints.
引用
收藏
页码:361 / 366
页数:6
相关论文
共 6 条
[1]  
[Anonymous], P 19 IEEE CPMT INT E
[2]  
CHARTRAND B, 1996, THESIS RENSSELAER PO
[3]  
HERMAN GT, 1980, IMAGE RECONSTRUCTION
[4]  
Kak A.C. Slaney M., 1999, PRINCIPLES COMPUTERI
[5]  
ROCKS SM, 1995, IEEE T COMP PACKAG M, V18, P851
[6]  
SIEWERT TA, 1994, MATER EVAL, P1194