Simplified thermal calculation method for floor structure in radiant floor cooling system

被引：49

作者：

Li, Qing-qing ^{[1
,2
]}

Chen, Chao ^{[1
]}

Zhang, Ye ^{[1
]}

Lin, Jie ^{[1
]}

Ling, Hao-shu ^{[1
]}

机构：

[1] Beijing Univ Technol, Coll Architecture & Civil Engn, Beijing 100124, Peoples R China

[2] Qingdao Agr Univ, Coll Architectural Engn, Qingdao 266109, Peoples R China

来源：

ENERGY AND BUILDINGS | 2014年 / 74卷

关键词：

Radiant floor; Cooling condition; Thermal calculation; Simplified method; Equivalent thickness; SIMULATION;

D O I：

10.1016/j.enbuild.2014.01.032

中图分类号：

TU [建筑科学];

学科分类号：

0813 ;

摘要：

In practical engineering application of radiant floor cooling system, both floor surface temperature and the lowest temperature in surface are more concerned because the former determine cooling capacity and indoor thermal comfort and the later is a key parameter for preventing condensation in floor surface based on consideration of the dew point in the indoor environment. In this paper, a simplified thermal calculation method for multilayer floor structure in radiant floor cooling system is proposed. Based on the analysis of heat transfer process of floor, the equivalent thermal resistance method is developed and some formulas are derived to estimate floor surface temperature distribution. The simplified calculation method is validated by experiments. The absolute error between simplified calculation and experiment results of floor surface temperature is within 0.4 degrees C. By this proposed method, it is helpful to easily estimate floor surface temperature distribution and analyze the influence of parameters of floor structure on thermal characteristic of floor. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：182 / 190

页数：9

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