This paper describes a method for improving manufacturing yield and reliability, of surface micomachined structures that are routinely employed for the fabrication of MicroElectroMechanical Systems (MEMS). Surface micromachined structures stiffer yield losses due to stiction, mechanical damage, and contamination as a result of handling and exposure to the environment prior to final assembly processes. While mechanical damage immediately destroys the device, contamination can lead to delayed costs such as lowered reliability, The technique described here employs a patented hydrofluoric acid (HF) vapor release process[1] at the device packaging stage, after sawing, die attach, wirebonding, and cleaning. Using this approach, released MEMS devices call be immediately enclosed without additional handling, leaving them free of contamination or potential mechanical damage. This technique would apply widely to a variety of MEMS, Additionally, this process has the potential to be scaled tip for high-volume production with significant yield improvements over conventional release and assembly processes. Included in this paper is a description of our MEMS fabrication process, the dry release method as applied to this novel packaging technique, and preliminary data collected oil sample devices using this packaging/release process.
