Buried solder bump connections for high-density capacitive coupling

被引：6

作者：

Mick, S ^{[1
]}

Luo, L ^{[1
]}

Wilson, J ^{[1
]}

Franzon, P ^{[1
]}

机构：

[1] N Carolina State Univ, Dept Elect & Comp Engn, Raleigh, NC 27695 USA

来源：

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2002年

关键词：

D O I：

10.1109/EPEP.2002.1057916

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

AC coupled interconnects enable reliable, multi-gigabit-per-second communication data rates between integrated circuits with very high pin counts and low power consumption. When used in conjunction with NRZ-tolerant receivers, interconnect arrays with pitches below 100mum and data rates of 6Gbps/per pin can be built.

引用

页码：205 / 208

页数：4