Study of electroless Ni-Cu-P coatings and their anti-corrosion properties

被引：112

作者：

Liu, Y ^{[1
]}

Zhao, Q ^{[1
]}

机构：

[1] Univ Dundee, Dept Mech Engn, Dundee DD1 4HN, Scotland

来源：

APPLIED SURFACE SCIENCE | 2004年 / 228卷 / 1-4期

基金：

英国工程与自然科学研究理事会;

关键词：

Ni-Cu-P; Ni-P; electroless deposition; corrosion;

D O I：

10.1016/j.apsusc.2003.12.031

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Copper content in electroless Ni-Cu-P alloy coatings mainly depends on pH, temperature and Cu2+ concentration in plating solution and has a significant effect on the corrosion resistance of the coatings. In this paper, the effects of pH, temperature, Cu2+ concentrations and substrate materials on the deposition rate and the coating compositions were studied. The coating thickness and their compositions were measured using a digital micrometer and an energy dispersive X-ray microanalysis (EDX), respectively. The anti-corrosion properties of the Ni-Cu-P coatings in HCl and NaCl solutions were investigated. The results showed that the corrosion resistance of the Ni-Cu-P alloy coatings was superior to that of electroless Ni-P coatings or copper. The optimal conditions for preparing these corrosion-resistant Ni-Cu-P coatings were obtained. (C) 2004 Elsevier B.V. All rights reserved.

引用

页码：57 / 62

页数：6

共 13 条

[1] Electroless deposition of Ni-Cu-P alloys in acidic solutions [J].