Study of electroless Ni-Cu-P coatings and their anti-corrosion properties

被引：111
|
作者：
Liu, Y [1 ]
Zhao, Q [1 ]
机构：
[1] Univ Dundee, Dept Mech Engn, Dundee DD1 4HN, Scotland
来源：
APPLIED SURFACE SCIENCE | 2004年 / 228卷 / 1-4期
基金：
英国工程与自然科学研究理事会;
关键词：
Ni-Cu-P; Ni-P; electroless deposition; corrosion;
D O I：
10.1016/j.apsusc.2003.12.031
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Copper content in electroless Ni-Cu-P alloy coatings mainly depends on pH, temperature and Cu2+ concentration in plating solution and has a significant effect on the corrosion resistance of the coatings. In this paper, the effects of pH, temperature, Cu2+ concentrations and substrate materials on the deposition rate and the coating compositions were studied. The coating thickness and their compositions were measured using a digital micrometer and an energy dispersive X-ray microanalysis (EDX), respectively. The anti-corrosion properties of the Ni-Cu-P coatings in HCl and NaCl solutions were investigated. The results showed that the corrosion resistance of the Ni-Cu-P alloy coatings was superior to that of electroless Ni-P coatings or copper. The optimal conditions for preparing these corrosion-resistant Ni-Cu-P coatings were obtained. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码：57 / 62
页数：6
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