Self-timed boundary-scan cells for multi-chip module test

被引:0
作者
García, TA [1 ]
Acosta, AJ [1 ]
Mora, JM [1 ]
Ramos, J [1 ]
Huertas, JL [1 ]
机构
[1] Univ Sevilla, Edificio CICA, CNM, Inst Microelect Sevilla, E-41012 Seville, Spain
来源
JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS | 1999年 / 15卷 / 1-2期
关键词
MCM testing; boundary-scan; self-timed CMOS design; testing interconnections;
D O I
10.1023/A:1008388318835
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a self-timed scan-path architecture, to be used in a conventional synchronous environment, and with basic application in digital testing and interconnections checking in a Smart-Substrate MCM (T.A. Garcia, A.J. Acosta, J.M. Mora, J. Ramos, and J.L. Huertas, "Self-Timed Boundary-Scan Cells for Multi-Chip Module Test," Proceedings of IEEE VLSI Test Symposium, April 1998, pp. 92-97). With this approach, the potential advantages of self-timed asynchronous systems are explored for their practical use in a classical MCM testing application. Three different self-timed asynchronous boundary scan cells are proposed (Sense, Drive and Drive&Sense cells) that can be connected to form a self-timed scan-path. The main advantage is that no global test clock is needed, avoiding clock skew and synchronization faults in test mode, and hence, a more reliable test process is achieved. These cells have been designed and integrated in active substrates, building several boundary-scan configurations and being fully compatible with the ANSI/IEEE 1149.1 Standard. The experimental results, as well as their comparison with their synchronous counterparts, show the feasibility of the proposed self-timed approach for testing interconnections in a MCM.
引用
收藏
页码:115 / 127
页数:13
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