ALUMINUM CHARGE/DIPOLE PASSIVATION INDUCED BY HYDROGEN DIFFUSION IN HIGH-K METAL GATE
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作者:
Ribes, G.
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机构:
STMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, FranceSTMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, France
Ribes, G.
[1
]
Barral, V.
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机构:
LETI, F-38926 Crolles, FranceSTMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, France
Barral, V.
[2
]
Chhun, S.
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机构:
STMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, FranceSTMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, France
Chhun, S.
[1
]
Gros-Jean, M.
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机构:
STMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, FranceSTMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, France
Gros-Jean, M.
[1
]
Caubet, P.
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STMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, FranceSTMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, France
Caubet, P.
[1
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Petit, D.
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机构:
STMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, FranceSTMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, France
Petit, D.
[1
]
机构:
[1] STMicroelect, 850 Rue Jean Monnet, F-38926 Crolles, France
[2] LETI, F-38926 Crolles, France
来源:
2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM
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2014年
关键词:
component;
High-K;
metal gate;
Aluminium;
hydrogen;
D O I:
暂无
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
In this study, we have analyzed the influence of different high-k (HK), interfacial layer (IL) and metal gate on the Al effect. We show that hydrogen diffusion during the BEOL process can suppress totally the Al effect on work function. Solutions to stabilize the Al effect with respect to hydrogen diffusion are proposed and a model explaining the hydrogen and Al interaction is provided.
机构:
Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics,Chinese Academy of SciencesKey Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics,Chinese Academy of Sciences
闫江
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机构:
赵超
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机构:
陈大鹏
叶甜春
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机构:
Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics,Chinese Academy of SciencesKey Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics,Chinese Academy of Sciences
叶甜春
王文武
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机构:
Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics,Chinese Academy of SciencesKey Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics,Chinese Academy of Sciences
机构:
SEMATECH, Austin, TX 78741 USASEMATECH, Austin, TX 78741 USA
Kang, C. Y.
Choi, R.
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机构:
Inha Univ, Sch Mat Sci & Engn, Inchon, South KoreaSEMATECH, Austin, TX 78741 USA
Choi, R.
Lee, B. H.
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机构:
Gwangju Inst Sci & Technol, Dept Mat Sci & Engn, Gwangji, South Korea
Gwangju Inst Sci & Technol, Dept Nanobio Mat Elect, Gwangji, South KoreaSEMATECH, Austin, TX 78741 USA
Lee, B. H.
Jammy, R.
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机构:
SEMATECH, Austin, TX 78741 USASEMATECH, Austin, TX 78741 USA