Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands

被引：23

作者：

Ali, Muhammad ^{[1
]}

Watanabe, Atom O. ^{[1
]}

Lin, Tong-Hong ^{[1
]}

Okamoto, Daichi ^{[2
]}

Pulugurtha, Markondeya Raj ^{[3
]}

Tentzeris, Manos M. ^{[1
]}

Tummala, Rao R. ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

[2] Taiyo Ink Mfg Co Ltd, Saitama 3550215, Japan

[3] Florida Int Univ, Dept Biomed Engn, Miami, FL 33199 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2020年 / 10卷 / 09期

关键词：

Antenna arrays; Power dividers; Antenna measurements; Glass; Packaging; 5G mobile communication; Yagi-Uda antennas; 5G and millimeter wave (mm-wave); antenna-in-package (AiP); new radio (NR); power divider; RF; semiadditive process; small cell; Yagi-Uda antenna; TECHNOLOGY;

D O I：

10.1109/TCPMT.2020.3013725

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Package-integrated and ultrathin power dividers with footprint smaller than unit lambda(2)(0) at the operating frequency of 28-GHz 5G new radio (NR) n257 and n258 bands are presented for the first time for small-cell applications. These power dividers are also configured as antenna arrays using endfire Yagi-Uda antenna elements. Utilizing minimal matching techniques, two-, three-, and four-element antenna arrays are designed without compromising on the bandwidth of operation or electrical performance. These thin-film power dividers exhibit a cross-sectional height of 147 mu m and can be implemented in the top metal layer of front- end module packages. Panel-compatible semiadditive patterning (SAP) process is utilized to realize these structures, which yields precise line space dimensions required for millimeter-wave (mm-wave) applications. This results in power dividers with low added insertion loss, low VSWR, and minimal phase difference between output ports. The added insertion loss is 25% less than similar structures reported on integrated fanout architectures. The antenna arrays exhibit high gain and efficiency. Excellent model-to-hardware correlation is observed with multiple coupons of the same structure. Package-integrated power dividers and antenna arrays based on ultrathin laminated glass substrate represent a major step toward realizing compact mm-wave antenna-in-package for 5G small-cell applications.

引用

页码：1515 / 1523

页数：9

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