Affinity-Driven Modeling and Scheduling for Makespan Optimization in Heterogeneous Multiprocessor Systems

被引:39
作者
Cao, Kun [1 ]
Zhou, Junlong [2 ]
Cong, Peijin [1 ]
Li, Liying [1 ]
Wei, Tongquan [1 ]
Chen, Mingsong [3 ]
Hu, Shiyan [4 ]
Hu, Xiaobo Sharon [5 ]
机构
[1] East China Normal Univ, Dept Comp Sci & Technol, Shanghai 200062, Peoples R China
[2] Nanjing Univ Sci & Technol, Sch Comp Sci & Engn, Nanjing 210094, Jiangsu, Peoples R China
[3] East China Normal Univ, Shanghai Key Lab Trustworthy Comp, Shanghai 200241, Peoples R China
[4] Michigan Technol Univ, Dept Elect & Comp Engn, Houghton, MI 49931 USA
[5] Univ Notre Dame, Dept Comp Sci & Engn, Notre Dame, IN 46656 USA
关键词
Affinity-driven modeling; makespan; reliability; scheduling; stochastic dependent tasks; temperature; PRECEDENCE CONSTRAINED TASKS; ENERGY; RELIABILITY;
D O I
10.1109/TCAD.2018.2846650
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
With the advent of heterogeneous multiprocessor architectures, efficient scheduling for high performance has been of significant importance. However, joint considerations of reliability, temperature, and stochastic characteristics of precedence-constrained tasks for performance optimization make task scheduling particularly challenging. In this paper, we tackle this challenge by using an affinity (i.e., probability)-driven task allocation and scheduling approach that decouples schedule lengths and thermal profiles of processors. Specifically, we separately model the affinity of a task for processors with respect to schedule lengths and the affinity of a task for processors with regard to chip thermal profiles considering task reliability and stochastic characteristics of task execution time and intertask communication time. Subsequently, we combine the two types of affinities, and design a scheduling heuristic that assigns a task to the processor with the highest joint affinity. Extensive simulations based on randomly generated stochastic and real-world applications are performed to validate the effectiveness of the proposed approach. Experiment results show that the proposed scheme can reduce the system makespan by up to 30.1% without violating the temperature and reliability constraints compared to benchmarking methods.
引用
收藏
页码:1189 / 1202
页数:14
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