GLASS MICROPROBE WITH EMBEDDED SILICON VIAS FOR 3D INTEGRATION

被引：0

作者：

Lin, Chiung-Wen ^{[1
]}

Chang, Chih-Wei ^{[2
]}

Lee, Yu-Tao ^{[1
]}

Chen, Rongshun ^{[1
,2
]}

Chang, Yen-Chung ^{[1
,3
]}

Fang, Weileun ^{[1
,2
]}

机构：

[1] Natl Tsing Hua Univ, Inst NanoEngn & Microsyst, Hsinchu, Taiwan

[2] Natl Tsing Hua Univ, Power Mech Eng Dept, Hsinchu 30013, Taiwan

[3] Natl Tsing Hua Univ, Inst Mol Med, Hsinchu 30013, Taiwan

来源：

IEEE 22ND INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2009) | 2009年

关键词：

ARRAY; PYREX;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study presents a novel process to realize glass 2D-microprobe array. The through silicon vias (TSVs) can also be integrated with the glass 2D-microprobe using the micromachining process. The vertical integration of chips containing glass 2D-microprobe array is realized using these silicon TSVs. The 3D-microprobe array and the signal processing IC can be easily implemented after vertical assembly of 2D-microprobe chips using bonding. In application, the 2D glass microprobe is fabricated with a low impedance of 439k Omega at 1kHz; and the neural recording experiment has also been successfully performed on a rat.

引用

页码：200 / 203

页数：4

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