GLASS MICROPROBE WITH EMBEDDED SILICON VIAS FOR 3D INTEGRATION

被引：0
|
作者：
Lin, Chiung-Wen [1 ]
Chang, Chih-Wei [2 ]
Lee, Yu-Tao [1 ]
Chen, Rongshun [1 ,2 ]
Chang, Yen-Chung [1 ,3 ]
Fang, Weileun [1 ,2 ]
机构：
[1] Natl Tsing Hua Univ, Inst NanoEngn & Microsyst, Hsinchu, Taiwan
[2] Natl Tsing Hua Univ, Power Mech Eng Dept, Hsinchu 30013, Taiwan
[3] Natl Tsing Hua Univ, Inst Mol Med, Hsinchu 30013, Taiwan
来源：
IEEE 22ND INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2009) | 2009年
关键词：
ARRAY; PYREX;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This study presents a novel process to realize glass 2D-microprobe array. The through silicon vias (TSVs) can also be integrated with the glass 2D-microprobe using the micromachining process. The vertical integration of chips containing glass 2D-microprobe array is realized using these silicon TSVs. The 3D-microprobe array and the signal processing IC can be easily implemented after vertical assembly of 2D-microprobe chips using bonding. In application, the 2D glass microprobe is fabricated with a low impedance of 439k Omega at 1kHz; and the neural recording experiment has also been successfully performed on a rat.
引用
收藏
页码：200 / 203
页数：4
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