Micromanufacturing: A review-Part I

被引:64
作者
Jain, V. K. [1 ]
Sidpara, Ajay [2 ]
Balasubramaniam, R. [3 ]
Lodha, G. S. [4 ]
Dhamgaye, V. P. [4 ]
Shukla, R. [4 ]
机构
[1] Indian Inst Technol, Dept Mech Engn, Kanpur 208016, Uttar Pradesh, India
[2] IIT Kharagpur, Dept Mech Engn, Kharagpur, W Bengal, India
[3] Bhabha Atom Res Ctr, Div Precis Engn, Bombay 400085, Maharashtra, India
[4] RRCAT, Div Precis Engn, Indore, Madhya Pradesh, India
关键词
Micromanufacturing; micromachining; LIGA; nanofinishing; thermal micromachining; electrochemical micromachining; X-RAY-LITHOGRAPHY; HIGH-ASPECT-RATIO; MOLECULAR-DYNAMICS SIMULATION; MATERIAL REMOVAL MECHANISM; COMB-DRIVE; SYNCHROTRON-RADIATION; BURR FORMATION; EDGE RADIUS; TOOL WEAR; MICRO;
D O I
10.1177/0954405414539487
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Micromanufacturing processes are expanding in their length and breadth as long as the related research and development (R&D) activities and applications are concerned. Products are getting miniaturized and their performance efficiency is getting enhanced by the addition of micro/nanofeatures and devices. In the set of these two articles (Part I and Part II), an attempt has been made to review the latest R&D activities of the selected micromanufacturing processes. This article (Part I) deals with a review of the literature related to attrition (subtractive, or machining and finishing) processes (both types-traditional and advanced) including microturning, micromilling, microdrilling, abrasive jet micromachining, laser beam micromachining, electrochemical micromachining, magnetorheological finishing, abrasive flow finishing, magnetic abrasive finishing, ion beam micromachining and so on. Apart from the subtractive processes, an overview of the X-ray lithography has also been presented. An attempt has been made to report some applications to help the readers to evolve more new applications of these processes. At the end of different sections/subsections, some research areas have been identified, which would hopefully fill the gaps between the theoretical analysis, experimental work and applications.
引用
收藏
页码:973 / 994
页数:22
相关论文
共 164 条
  • [71] MD simulation of indentation and scratching of single crystal aluminum
    Komanduri, R
    Chandrasekaran, N
    Raff, LM
    [J]. WEAR, 2000, 240 (1-2) : 113 - 143
  • [72] KOPALINSKY EM, 1984, INST PHYS CONF SER, P389
  • [73] Microspectrometer system for the near infrared wavelength range based on the LIGA technology
    Krippner, P
    Kühner, T
    Mohr, J
    Saile, V
    [J]. MICRO- AND NANOTECHNOLOGY FOR BIOMEDICAL AND ENVIRONMENTAL APPLICATIONS, 2000, 1 : 141 - 149
  • [74] Influence of feed motion features on small holes drilling process
    Kudla, L
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2001, 109 (03) : 236 - 241
  • [75] Kulkarni VN, 2013, MICROMANUFACTURING PROCESSES, P113
  • [76] Temperature distribution in the workpiece due to plane magnetic abrasive finishing using FEM
    Kumar, Gurvinder
    Yadav, Vinod
    [J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2009, 41 (11-12) : 1051 - 1058
  • [77] Modelling and analysis of micro scale milling considering size effect, micro cutter edge radius and minimum chip thickness
    Lai, Xinmin
    Li, Hongtao
    Li, Chengfeng
    Lin, Zhongqin
    Ni, Jun
    [J]. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2008, 48 (01) : 1 - 14
  • [78] Electrochemical micromachining, polishing and surface structuring of metals: fundamental aspects and new developments
    Landolt, D
    Chauvy, PF
    Zinger, O
    [J]. ELECTROCHIMICA ACTA, 2003, 48 (20-22) : 3185 - 3201
  • [79] Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes
    Lee, H. S.
    Jeong, H. D.
    Dornfeld, D. A.
    [J]. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2013, 37 (02): : 483 - 490
  • [80] An investigation of residual form error compensation in the ultra-precision machining of aspheric surfaces
    Lee, WB
    Cheung, CF
    Chiu, WM
    Leung, TP
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2000, 99 (1-3) : 129 - 134