Polymer flip-chip integrated AlGaAsSb/AlGaSb p-i-n photodetectors for 1550-nm high-speed optical interconnects

被引:0
|
作者
Lohokare, SK [1 ]
Schuetz, CA [1 ]
Lu, Z [1 ]
Prather, DW [1 ]
Sulima, OV [1 ]
Cox, JA [1 ]
Solov'ev, VA [1 ]
Ivanov, SV [1 ]
Li, JV [1 ]
机构
[1] Univ Delaware, Dept Elect & Comp Engn, Newark, DE 19716 USA
来源
SEMICONDUCTOR PHOTODETECTORS | 2004年 / 5353卷
关键词
high-speed optical interconnections; inductively coupled plasma (ICP) etching of; antimonides; flip chip integration; conductive polymer based interconnections;
D O I
10.1117/12.527869
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
AlGaAsSb/AlGaSb heterostructures offer the ability to realize high-performance devices for 1550 nm high-speed optical interconnect applications. In this context, we present the design, fabrication, integration and characterization of 10 GHz p-i-n photodetectors in this material system. This effort has involved an investigation into inductively coupled plasma (ICP) etching of these materials and the development of a novel process for their conductive polymer based flip chip die attach.
引用
收藏
页码:36 / 47
页数:12
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