Poly(N-methylpyrrole) electrodeposited on copper: Corrosion protection properties

被引：31

作者：

Redondo, M. L. ^{[1
]}

Sanchez de la Blanca, E. ^{[1
]}

Garcia, M. V. ^{[1
]}

Gonzalez-Tejera, M. J. ^{[1
]}

机构：

[1] Univ Complutense Madrid, Fac Ciencias Quim, Dept Quim Fis 1, E-28040 Madrid, Spain

来源：

PROGRESS IN ORGANIC COATINGS | 2009年 / 65卷 / 03期

关键词：

Corrosion protection; Conducting polymers; Poly(N-methylpyrrole); ELECTROCHEMICAL SYNTHESIS; POLYPYRROLE FILMS; AQUEOUS-SOLUTION; PYRROLE; ELECTROPOLYMERIZATION; BRASS; PERFORMANCE; IMPEDANCE; COATINGS; BEHAVIOR;

D O I：

10.1016/j.porgcoat.2009.03.003

中图分类号：

O69 [应用化学];

学科分类号：

081704 ;

摘要：

Electrochemical synthesis of poly(N-methylpyrrole) films on copper electrodes from an aqueous oxalic acid has been achieved. A potential higher than 2 V (SCE) was needed to generate the polymer, for this reason, the polymer was in the overoxidized state. The inhibiting corrosion properties of this coating on copper were investigated for the first time in aqueous 0.1 M sodium chloride solution using potentiodynamic polarization, Tafel analyses. open-circuit potential and electrochemical impedance spectroscopy. Corrosion protection properties comparable to those of polypyrrole (PPy) films were observed for these films. A physical barrier effect is the most likely protection mechanism. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：386 / 391

页数：6

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