Cost-effective IR-Drop Failure Identification and Yield Recovery through a Failure-adaptive Test Scheme

被引:0
作者
Chen, Mingjing [1 ]
Orailoglu, Alex [1 ]
机构
[1] Univ Calif San Diego, CSE Dept, La Jolla, CA 92093 USA
来源
2010 DESIGN, AUTOMATION & TEST IN EUROPE (DATE 2010) | 2010年
关键词
D O I
暂无
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Ever-increasing test mode IR-drop results in a significant amount of defect-free chips failing at-speed testing. The lack of a systematic IR-drop failure identification technique engenders a highly increased failure analysis time/cost and significant yield loss. In this paper, we propose a failure-adaptive test scheme that enables a fast differentiation of the IR-drop induced failure from the actual defects of the chip. The proposed technique debugs the failing chips using low IR-drop vectors that are custom-generated from the observed faulty response. Since these special vectors are designed in such a way that all the actual defects captured by the original vectors are still manifestable, their application can clearly pinpoint whether the root cause of failure is IR-drop or not, thus eliminating reliance on an intrusive debugging process that incurs quite a high cost. Such a test scheme further enables effective yield recovery from failing chips by passing the ones validated by the debugging vectors whose IR-drop level matches the functional mode. Experimental results show that the proposed scheme delivers a significant IRdrop reduction in the second test (debugging) phase, thus enabling a highly effective IR-drop failure identification and yield recovery at a slightly increased test cost.
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收藏
页码:63 / 68
页数:6
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