Monolithic Integration of AlGaN/GaN HEMT on LED by MOCVD

被引:86
作者
Liu, Zhao Jun [1 ]
Huang, Tongde [1 ]
Ma, Jun [1 ]
Liu, Chao [1 ]
Lau, Kei May [1 ]
机构
[1] Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Hong Kong, Hong Kong, Peoples R China
关键词
AlGaN/GaN; high electron mobility transistor (HEMT); light emitting diode (LED); metal organic chemical vapor deposition (MOCVD); SI SUBSTRATE;
D O I
10.1109/LED.2014.2300897
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Monolithic integration of high-performance AlGaN/GaN high-electron mobility transistors (HEMTs) and blue light emitting diodes (LEDs) on sapphire substrates has been demonstrated by metal organic chemical vapor deposition selective growth technique. The integrated HEMT-LED exhibits a peak transconductance (G(m)) of 244 mS/mm, a maximum drain current (I-d) of 920 mA/mm, and an ON-resistance (R-on) of 2.6 Omega center dot mm. The forward voltage (V-F) of the LED is 3.1 V under an injection current of 10 mA. The integrated LED emits modulated light power efficiently at a wavelength of 470 nm by a serially connected GaN HEMT, showing potential applications such as solid-state lighting, displays, and visible light communications.
引用
收藏
页码:330 / 332
页数:3
相关论文
共 10 条
  • [1] DC and RF Performance of Gate-Last AlN/GaN MOSHEMTs on Si With Regrown Source/Drain
    Huang, Tongde
    Liu, Zhao Jun
    Zhu, Xueliang
    Ma, Jun
    Lu, Xing
    Lau, Kei May
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2013, 60 (10) : 3019 - 3024
  • [2] Enhancement-Mode AlN/GaN MOSHFETs on Si Substrate With Regrown Source/Drain by MOCVD
    Huang, Tongde
    Zhu, Xueliang
    Lau, Kei May
    [J]. IEEE ELECTRON DEVICE LETTERS, 2012, 33 (08) : 1123 - 1125
  • [3] Monolithic integration of nitride-based transistor with Light Emitting Diode for sensing applications
    Kalaitzakis, F. G.
    Iliopoulos, E.
    Konstantinidis, G.
    Pelekanos, N. T.
    [J]. MICROELECTRONIC ENGINEERING, 2012, 90 : 33 - 36
  • [4] Performance improvement of GaN-based light-emitting diodes grown on patterned Si substrate transferred to copper
    Lau, Kei May
    Wong, Ka Ming
    Zou, Xinbo
    Chen, Peng
    [J]. OPTICS EXPRESS, 2011, 19 (14): : A956 - A961
  • [5] 3000-V 4.3-Ω . cm2 InAlN/GaN MOSHEMTs With AlGaN Back Barrier
    Lee, Hyung-Seok
    Piedra, Daniel
    Sun, Min
    Gao, Xiang
    Guo, Shiping
    Palacios, Tomas
    [J]. IEEE ELECTRON DEVICE LETTERS, 2012, 33 (07) : 982 - 984
  • [6] Leung WY, 2008, PROC EUR SOLID-STATE, P354, DOI 10.1109/ESSCIRC.2008.4681865
  • [7] Monolithic integration of light-emitting diodes and power metal-oxide-semiconductor channel high-electron-mobility transistors for light-emitting power integrated circuits in GaN on sapphire substrate
    Li, Z.
    Waldron, J.
    Detchprohm, T.
    Wetzel, C.
    Karlicek, R. F., Jr.
    Chow, T. P.
    [J]. APPLIED PHYSICS LETTERS, 2013, 102 (19)
  • [8] GaN-Based RF power devices and amplifiers
    Mishra, Umesh K.
    Shen, Likun
    Kazior, Thomas E.
    Wu, Yi-Feng
    [J]. PROCEEDINGS OF THE IEEE, 2008, 96 (02) : 287 - 305
  • [9] Prospects for LED lighting
    Pimputkar, Siddha
    Speck, James S.
    DenBaars, Steven P.
    Nakamura, Shuji
    [J]. NATURE PHOTONICS, 2009, 3 (04) : 179 - 181
  • [10] 8300V blocking voltage AlGaN/GaN power HFET with thick poly-AlN passivation
    Uemoto, Yasuhiro
    Shibata, Daisuke
    Yanagihara, Manabu
    Ishida, Hidetoshi
    Matsuo, Hisayoshi
    Nagai, Shuichi
    Batta, Nagaraj
    Li, Ming
    Ueda, Tetsuzo
    Tanaka, Tsuyoshi
    Ueda, Daisuke
    [J]. 2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2007, : 861 - +