共 50 条
- [1] Model of a fast resonant cavity for triangular power and ground planes Qiu, J. (jtqiu@mail.xidian.edu.cn), 1600, Science Press (39):
- [2] An efficient and flexible modeling for power/ground planes ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2006, : 83 - +
- [3] Analytical Modeling of Power Pin Impedance in Parallel Power & Ground Planes 2018 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION (NEMO), 2018,
- [4] Study on Triangular EBG Unit Cell Structures for Suppression of SSN in Power/Ground Planes 2015 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2015, : 1290 - 1293
- [5] Efficient Modeling of Power/Ground Planes Using Delay-Extraction-Based Transmission Lines IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (05): : 761 - 771
- [6] Hybrid Modeling Method for Transient Simulation of Multilayered Power/Ground Planes 2012 IEEE 21ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2012, : 288 - 291
- [7] Modeling of Multilayered Power/Ground Planes Based on Resonant Cavity Algorithm IEEE ACCESS, 2018, 6 : 67360 - 67372
- [8] Hybrid Modeling Method for Multilayered Power/Ground Planes by Delaunay Triangulation 2014 IEEE 23RD CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2014, : 155 - 158
- [9] New efficient method of modeling electronics packages with power and ground planes ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2001, : 237 - 240