Modeling of Power/Ground Planes Using Triangular Elements

被引:2
|
作者
Choi, Jae Young [1 ]
Swaminathan, Madhavan [2 ]
机构
[1] Oracle Corp, Burlington, MA 01803 USA
[2] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
关键词
Delaunay triangulation; electromagnetic modeling; power delivery network (PDN); power integrity; Voronoi tessellation; SEGMENTATION METHOD; NUMERICAL-SOLUTION; SWITCHING NOISE; POWER; DESIGN;
D O I
10.1109/TCPMT.2013.2277659
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
As the operating frequency of electronic devices increases and system miniaturization continues, designing power delivery networks (PDNs) that supply quality power throughout the system becomes very challenging. To guarantee successful performance of the PDN, an accurate and time-efficient simulation method that computes the PDN impedance is required. In this paper, we propose a computationally efficient PDN modeling method that analyzes multilayer power/ground planes. The proposed method solves the differential form of Maxwell's equation applied on the circuit representation of a plane pair. To use the analogy between the equations of the electromagnetic field and the equivalent circuit, a dual mesh is created on the metal surface. The use of a nonuniform triangular mesh enables effective discretization of multidimensional and irregular geometries. Moreover, the differential equation generates a sparse system matrix, which requires small computer resources. The proposed model is extended to multiple plane pairs, and the modeling of apertures located on any layer is also included. Simulation results show that the proposed method can solve complex structures with less computational effort than other modeling methods, while maintaining accuracy. In addition, the application of the absorbing boundary condition (ABC) to the proposed method is presented. Applying ABC to the plane boundaries prevents outgoing waves from reflecting back into the plane pair, hence removing plane resonances. The use of the first-order ABC results in a simple implementation and the results show good correlation with the results from a full-wave solver using higher order ABC.
引用
收藏
页码:291 / 302
页数:12
相关论文
共 50 条
  • [1] Model of a fast resonant cavity for triangular power and ground planes
    Qiu, J. (jtqiu@mail.xidian.edu.cn), 1600, Science Press (39):
  • [2] An efficient and flexible modeling for power/ground planes
    Wu, Kai-Bin
    Shiue, Guang-Hwa
    Guo, Wei-Da
    Lin, Chien-Min
    Wu, Ruey-Beei
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2006, : 83 - +
  • [3] Analytical Modeling of Power Pin Impedance in Parallel Power & Ground Planes
    Erdin, Ihsan
    Achar, Ram
    2018 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION (NEMO), 2018,
  • [4] Study on Triangular EBG Unit Cell Structures for Suppression of SSN in Power/Ground Planes
    Kwon, Jong Hwa
    Sim, Dong Uk
    Kwak, Sang Il
    2015 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2015, : 1290 - 1293
  • [5] Efficient Modeling of Power/Ground Planes Using Delay-Extraction-Based Transmission Lines
    Roy, Sourajeet
    Dounavis, Anestis
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (05): : 761 - 771
  • [6] Hybrid Modeling Method for Transient Simulation of Multilayered Power/Ground Planes
    Watanabe, Takayuki
    2012 IEEE 21ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2012, : 288 - 291
  • [7] Modeling of Multilayered Power/Ground Planes Based on Resonant Cavity Algorithm
    Wang, Jun
    Lu, Jianmin
    Chu, Xiuqin
    Liu, Yang
    Li, Yushan
    IEEE ACCESS, 2018, 6 : 67360 - 67372
  • [8] Hybrid Modeling Method for Multilayered Power/Ground Planes by Delaunay Triangulation
    Watanabe, Takayuki
    2014 IEEE 23RD CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2014, : 155 - 158
  • [9] New efficient method of modeling electronics packages with power and ground planes
    Shi, WM
    Fang, JY
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2001, : 237 - 240
  • [10] Efficient modeling of rerouted return currents in multilayered power-ground planes by using integral equation
    Wei, Xing-Chang
    Li, Er-Ping
    Liu, En-Xiao
    Xing Cui
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2008, 50 (03) : 740 - 743