3D Interdigitated Microsupercapacitors with Record Areal Cell Capacitance

被引：43

作者：

Ferris, AnalS ^{[1
,2
]}

Bourrier, David ^{[1
]}

Garbarino, Sebastien ^{[2
,3
]}

Guay, Daniel ^{[2
]}

Pech, David ^{[1
]}

机构：

[1] Univ Toulouse, LAAS CNRS, F-31400 Toulouse, France

[2] INRS Energie Mat & Telecommun, 1650 Blvd Lionel Boulet, Varennes, PQ J3X 1S2, Canada

[3] PRIMA Quebec, 505 Blvd Maisonneuve Ouest, Montreal, PQ H3A 3C2, Canada

来源：

SMALL | 2019年 / 15卷 / 27期

基金：

欧洲研究理事会; 加拿大自然科学与工程研究理事会;

关键词：

3D; interdigitated; microfabrication; microsupercapacitors; pseudocapacitance; ENERGY-DENSITY; MICRO-SUPERCAPACITORS; ELECTRODES; OXIDE; FILMS;

D O I：

10.1002/smll.201901224

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

Due to their high-power density and long lifetime, microsupercapacitors have been considered as an efficient energy supply/storage solution for the operation of small electronic devices. However, their fabrication remains confined to 2D thin-film microdevices with limited areal energy. In this study, the integration of all-solid-state 3D interdigitated microsupercapacitors on 4 in. silicon wafers with record energy density is demonstrated. The device electrodes are composed of a pseudocapacitive hydrated ruthenium dioxide RuO2 deposited onto highly porous current collectors. The encapsulated devices exhibit cell capacitance of 812 mF cm(-2) per footprint area at an energy density of 329 mJ cm(-2), which is the highest value ever reported for planar configuration. These components achieve one of the highest surface energy/power density trade-offs and address the issue of electrical energy storage of modern electronics.

引用

页数：8

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