Evaluation of Transient Liquid Phase Bonding Between Titanium and Steel

Microstructural development in copper-interlayer transient liquid phase (TLP) bonds between commercially pure (CP) Ti and low carbon steel, was reported. CP Ti grade 2 and low carbon steel of 2 mm thickness sheet were used. The plates were cut into 30 × 25 mm2 chips for shear strength testing and 10 × 10 mm2 chips for microstructural analysis. These specimens were then subjected to several stages of grinding papers up to 1000 grit and subsequently ultrasonically cleaned by acetone before brazing. TLP experiments were carried out at 870 and 910°C to study the effect of the temperature on the metallurgical and mechanical properties of the joint. Observations with SEM revealed that different regions with different chemical analysis were formed in the brazed area. The interaction layers at the steel/Cu based brazing alloy presented the highest hardness values owing to the formation of FeTi and Ti3Cu4 at the interface.