Carrier injection from gold electrodes into thioacetyl-end-functionalized poly(para-phenyleneethynylene)s -: art. no. 165207

被引：21

作者：

Hu, WP ^{[1
]}

Nakashima, H ^{[1
]}

Furukawa, K ^{[1
]}

Kashimura, Y ^{[1
]}

Ajito, K ^{[1
]}

Han, C ^{[1
]}

Torimitsu, K ^{[1
]}

机构：

[1] NTT Corp, NTT Basic Res Labs, Kanagawa 2430198, Japan

来源：

PHYSICAL REVIEW B | 2004年 / 69卷 / 16期

关键词：

D O I：

10.1103/PhysRevB.69.165207

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Carrier injection from a gold electrode into a thioacetyl-end-functionalized polymer, poly(para-phenyleneethynylene)s (TA-PPE), has been investigated by using sandwich and nanogap electrode devices. The results suggest that carrier injection depends on the organized status of the Au/TA-PPE interface. For sandwich devices with spin-coated TA-PPE films, carrier injection is dominated by a thermal emission mechanism with a barrier height of around 1.16 eV. However, as regards devices with nanogap electrodes, when the Au/TA-PPE interface is poorly organized, the carrier injection is dominated by a mixed mechanism consisting of thermal emission and tunneling. When the Au/TA-PPE interface is well organized, i.e., most of the molecules are connected to the Au electrode by Au-S bonds, and the carrier injection is dominated by tunneling, the tunneling barrier height Phi(B) is estimated to be around 1.33-1.43 eV.

引用

页码：165207 / 1

页数：6

共 58 条

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