New results using membrane-supported circuits: A Ka-band power amplifier and survivability testing

被引：9

作者：

Weller, TM

Katehi, LPB

Herman, MI

Wamhof, PD

Lee, K

Kolawa, EA

Tai, BH

机构：

[1] UNIV MICHIGAN,RADIAT LAB,ANN ARBOR,MI 48109

[2] CALTECH,JET PROP LAB,PASADENA,CA 91109

[3] CORE DYNAM CORP,IRVINE,CA 91109

[4] UNIV CALIF DAVIS,DEPT MAT SCI & CHEM ENGN,DAVIS,CA 95616

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1996年 / 44卷 / 09期

基金：

美国国家航空航天局;

关键词：

Number:; -; Acronym:; NASA; Sponsor: National Aeronautics and Space Administration; SC; Sponsor: Office of Science; U-M; Sponsor: University of Michigan;

D O I：

10.1109/22.536614

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes recent results which pertain to the integration and reliability testing of micromachined, membrane-supported transmission line circuits. These circuits employ a 1.4- mu m-thick dielectric membrane to support thin-film conducting Lines above an air substrate. With regard to integration, the development of a Ka-band solid state power amplifier (SSPA) is presented. The design includes a membrane-supported Wilkinson power divider/combiner with 0.2 dB loss, along with a commercially available monolithic microwave/millimeter wave integrated circuit (MMIC) amplifier stage. Also reported are tests which investigated the survivability of membrane lines under space qualification conditions. No failures occurred as a result of thermal cycling and vibration testing at levels which reached 39.6 grms.

引用

页码：1603 / 1606

页数：4

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