Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder

被引：8

作者：

Huang Huizhen ^{[1
]}

Wei Xiuqin ^{[1
]}

Liao Fuping ^{[1
]}

Zhou Lang ^{[1
]}

机构：

[1] Nanchang Univ, Sch Mat Sci & Engn, Nanchang 330031, Peoples R China

来源：

JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION | 2009年 / 24卷 / 02期

关键词：

lead-free solder; Sn-Zn alloy; Cu powders; composite solder; wettability; MICROSTRUCTURE;

D O I：

10.1007/s11595-009-2206-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ Cu5Zn8 particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn.

引用

页码：206 / 209

页数：4

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