Effect of Al doping on the retention behavior of memories HfO2 resistive switching

被引:54
作者
Frascaroli, Jacopo [1 ,2 ]
Volpe, Flavio Giovanni [1 ]
Brivio, Stefano [1 ]
Spiga, Sabina [1 ]
机构
[1] CNR, IMM, Lab MDM, I-20864 Agrate Brianza, MB, Italy
[2] Univ Milan, Dept Phys, Milan, Italy
关键词
RRAM; Hafnium oxide; Aluminum; Doping; Retention; FILMS;
D O I
10.1016/j.mee.2015.04.043
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The retention behavior of HfO2-based resistive switching memory cells (REAM) is characterized as a function of Al doping concentration, which was previously reported to be a viable method for the improvement of the switching uniformity. While the low resistance state (LRS) does not exhibit any major variation up to 10(6) s for all the tested devices, two retention loss mechanisms can be identified for the high resistance state (HRS). The main HRS trend follows a temperature-activated gradual decrease of the resistance, which also depends on the doping concentration. In addition, tail bits of the population distribution show a very fast retention loss process that strongly depends on the doping concentration. (C) 2015 Elsevier B.V. All rights reserved.
引用
收藏
页码:104 / 107
页数:4
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