Three-dimensional CMOS image sensor for pedestrian protection and collision mitigation

被引：10

作者：

Mengel, P. ^{[1
,2
]}

Listl, L. ^{[1
,2
]}

Koenig, B. ^{[1
,2
]}

Toepfer, C. ^{[1
,2
]}

Pellkofer, M. ^{[1
,2
]}

Brockherde, W. ^{[1
,2
]}

Hosticka, B. ^{[1
,2
]}

Elkhalili, O. ^{[1
,2
]}

Schrey, O. ^{[1
,2
]}

Ulfig, W. ^{[1
,2
]}

机构：

[1] Siemens AG, CT PS 9,Otto Hahn Ring 6, D-81739 Munich, Germany

[2] Fraunhofer IMS, D-81739 Munich, Germany

来源：

ADVANCED MICROSYSTEMS FOR AUTOMOTIVE APPLICATIONS 2006 | 2006年

关键词：

D O I：

10.1007/3-540-33410-6_3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Future car safety systems increasingly depend on the availability of robust sensors with vital improved technical perception output. For this objective, we develop a pulsed laser based time of flight range sensor in fully solid-state microsystems technology for more reliable detection and classification of road users, vehicles and traffic obstacles. The development aims on pedestrian protection and mitigation of collisions comprising the short distance around vehicle perception up to 25 m. The 3D sensor technology based on a chip design of 64x8 pixels and image repetition rates of up to 100 Hz will be presented and the performance of a first 3D line sensor prototype will be demonstrated for typical road test scenarios. Furthermore, an outlook on the final 3D array camera development for road safety applications will be given.

引用

页码：23 / 39

页数：17

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