Failure analysis of printed circuit boards in the main telephone system of marine product factory

被引：4

作者：

Watanabe, Masamitsu ^{[1
]}

Takaya, Masaaki ^{[1
]}

Matsumoto, Morihiko ^{[1
]}

Sakai, Jun'ichi ^{[2
]}

机构：

[1] Nippon Telegraph & Tel East Corp, Tech Assistance & Support Ctr, Ota Ku, 1-2-5 Kamatahoncho, Tokyo 1440053, Japan

[2] Waseda Univ, Grad Sch Fundamental Sci & Engn, Shinjuku Ku, 3-4-1 Okubo, Tokyo 1698555, Japan

来源：

ENGINEERING FAILURE ANALYSIS | 2016年 / 62卷

关键词：

Copper; Sulfide creep; Hydrogen sulfide; Printed circuit board; Via; TARNISH FILMS;

D O I：

10.1016/j.engfailanal.2016.01.006

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

The failure of themain telephone systemin amarine product factory due to copper sulfide (Cu2S) creep was analyzed by themeasurement of hydrogen sulfide (H2S) in the atmosphere, elemental analysis with energy dispersive X-ray spectroscopy, and cross-sectional observation of vias in the printed circuit boards. Indoor H2S concentrations were higher than outdoor ones and these corresponded to the G2 and/or G3 levels defined in ISA S71.04-1985. The chemical composition of the copper sulfide creep indicates that it consisted of copper, oxygen, and sulfur. Crosssectional observation and elemental mapping analysis showed that Cu2S creep initiated not at the edge of the organic coating (organic solder preservative, OSP) inside the vias butmainly at defects in the organic coating covering the copper. (C) 2016 Elsevier Ltd. All rights reserved.

引用

页码：300 / 305

页数：6

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