Failure analysis of printed circuit boards in the main telephone system of marine product factory

被引：4
作者：
Watanabe, Masamitsu [1 ]
Takaya, Masaaki [1 ]
Matsumoto, Morihiko [1 ]
Sakai, Jun'ichi [2 ]
机构：
[1] Nippon Telegraph & Tel East Corp, Tech Assistance & Support Ctr, Ota Ku, 1-2-5 Kamatahoncho, Tokyo 1440053, Japan
[2] Waseda Univ, Grad Sch Fundamental Sci & Engn, Shinjuku Ku, 3-4-1 Okubo, Tokyo 1698555, Japan
来源：
ENGINEERING FAILURE ANALYSIS | 2016年 / 62卷
关键词：
Copper; Sulfide creep; Hydrogen sulfide; Printed circuit board; Via; TARNISH FILMS;
D O I：
10.1016/j.engfailanal.2016.01.006
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
The failure of themain telephone systemin amarine product factory due to copper sulfide (Cu2S) creep was analyzed by themeasurement of hydrogen sulfide (H2S) in the atmosphere, elemental analysis with energy dispersive X-ray spectroscopy, and cross-sectional observation of vias in the printed circuit boards. Indoor H2S concentrations were higher than outdoor ones and these corresponded to the G2 and/or G3 levels defined in ISA S71.04-1985. The chemical composition of the copper sulfide creep indicates that it consisted of copper, oxygen, and sulfur. Crosssectional observation and elemental mapping analysis showed that Cu2S creep initiated not at the edge of the organic coating (organic solder preservative, OSP) inside the vias butmainly at defects in the organic coating covering the copper. (C) 2016 Elsevier Ltd. All rights reserved.
引用
收藏
页码：300 / 305
页数：6
相关论文
共 50 条
  • [21] Failure of Printed Circuit Boards during Storage and Service: Leaked Capacitors and White Residue
    Ravi Shankar, A.
    Praveen, K.
    Polaki, S. R.
    Vanithakumari, S. C.
    Krishna, Nanda Gopala
    Srivani, L.
    George, R. P.
    Philip, John
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2020, 29 (10) : 6402 - 6411
  • [22] Failure of Printed Circuit Boards during Storage and Service: Leaked Capacitors and White Residue
    A. Ravi Shankar
    K. Praveen
    S. R. Polaki
    S. C. Vanithakumari
    Nanda Gopala Krishna
    L. Srivani
    R. P. George
    John Philip
    Journal of Materials Engineering and Performance, 2020, 29 : 6402 - 6411
  • [23] Multi-element chemical analysis of printed circuit boards - challenges and pitfalls
    Korf, Nathalie
    Lovik, Amund N.
    Figi, Renato
    Schreiner, Claudia
    Kuntz, Claudia
    Maehlitz, Paul Martin
    Rosslein, Matthias
    Wager, Patrick
    Rotter, Vera Susanne
    WASTE MANAGEMENT, 2019, 92 : 124 - 136
  • [24] Analysis of via in multilayer printed circuit boards for high-speed digital systems
    Kim, JH
    Han, SW
    Kwon, OK
    ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 382 - 387
  • [25] Bioleaching of End-of-Life Printed Circuit Boards: Mathematical Modeling and Kinetic Analysis
    Becci, Alessandro
    Amato, Alessia
    Rodriguez-Maroto, Jose M.
    Beolchini, Francesca
    INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, 2021, 60 (11) : 4261 - 4268
  • [26] Failure Analysis of Leakage Current for Multilayer Printed Circuit Board
    Xiang Wang
    Wangping Wu
    Dingkai Xie
    Peng Jiang
    Zhizhi Wang
    Yi Zhang
    Journal of Failure Analysis and Prevention, 2020, 20 : 1621 - 1627
  • [27] Failure Analysis of Leakage Current for Multilayer Printed Circuit Board
    Wang, Xiang
    Wu, Wangping
    Xie, Dingkai
    Jiang, Peng
    Wang, Zhizhi
    Zhang, Yi
    JOURNAL OF FAILURE ANALYSIS AND PREVENTION, 2020, 20 (05) : 1621 - 1627
  • [28] Simulation and economic analysis of a hydrometallurgical approach developed for the treatment of waste printed circuit boards (WPCB)
    Birloaga, I
    Veglio, F.
    GLOBAL NEST JOURNAL, 2018, 20 (04): : 695 - 699
  • [29] Enhancing an Automated Inspection System on Printed Circuit Boards Using Affine-SIFT and TRIZ Techniques
    Aghamohammadi, Amirhossein
    Ang, Mei Choo
    Prabuwono, Anton Satria
    Mogharrebi, Marzieh
    Ng, Kok Weng
    ADVANCES IN VISUAL INFORMATICS, 2013, 8237 : 128 - 137
  • [30] Copper, zinc, and nickel recovery from printed circuit boards using an ammonia–ammonium sulphate system
    Sílvia C. Pinho
    Cristiana Ribeiro
    Conceição A. Ferraz
    Manuel F. Almeida
    Journal of Material Cycles and Waste Management, 2021, 23 : 1456 - 1465
12345