CMOS-BASED HIGH-DENSITY SILICON MICROPROBE ARRAY FOR ELECTRONIC DEPTH CONTROL IN NEURAL RECORDING

被引:23
作者
Seidl, K. [1 ]
Herwik, S. [1 ]
Nurcahyo, Y. [1 ]
Torfs, T. [2 ]
Keller, M. [1 ]
Schuettler, M. [1 ]
Neves, H.
Stieglitz, T. [1 ,2 ]
Paul, O. [1 ]
Ruther, P. [1 ]
机构
[1] Univ Freiburg, Dept Microsyst Engn IMTEK, Freiburg, Germany
[2] IMEC, Brugge, Belgium
来源
IEEE 22ND INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2009) | 2009年
关键词
UNIT;
D O I
10.1109/MEMSYS.2009.4805361
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports on a novel CMOS-based high-density silicon microprobe array for intracortical recording applications. In contrast to existing systems, CMOS multiplexing units are integrated on the slender, needle-like probe shaft 160 mu m in width. In the present implementation an unequaled number of 188 electrodes (diameter 20 mu m, pitch 40 mu m) are arranged in two columns along the 4-mm-long probe shaft. The on-shaft integration of electronics is motivated by the requirement to discriminate single action potentials in extracellular recordings necessitating a close proximity between the neuron of interest and the recording electrode. Instead of a mechanical movement of the probe shaft carrying the electrode, the position adjustment during long-term recordings is performed by switching between different electrodes arranged in a dense array. The paper presents the probe concept, the post-CMOS fabrication process and initial measurements evaluating electrode impedance and probe performance during measurements in saline solution.
引用
收藏
页码:232 / 235
页数:4
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