Grain growth in ultrafine grain sized copper during cyclic deformation

被引：18

作者：

Han, Seung Zeon ^{[1
]}

Goto, Masahiro ^{[2
]}

Ahn, Jee-Hyuk ^{[1
]}

Lim, Sung Hwan ^{[3
]}

Kim, Sangshik ^{[4
]}

Lee, Jehyun ^{[5
]}

机构：

[1] Korea Inst Mat Sci, Struct Mat Div, Chang Won 642831, South Korea

[2] Oita Univ, Dept Mech Engn, Oita 8701192, Japan

[3] Kangwon Natl Univ, Dept Adv Mat Sci & Engn, Chunchon, South Korea

[4] Gyeongsang Natl Univ, ReCAPT, Dept Met & Mat Engn, Chinju, South Korea

[5] Chagwon Natl Univ, Dept Adv Mat Engn, Chang Won 641773, South Korea

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2014年 / 615卷

基金：

新加坡国家研究基金会;

关键词：

Copper; ECAP; Nano-grain; Dynamic recrystallization; Fatigue strength; FATIGUE; RECRYSTALLIZATION; EVOLUTION; SURFACE; ALLOY;

D O I：

10.1016/j.jallcom.2013.12.004

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The nano-sized grain microstructure of pure copper was achieved by Equal Channel Angular Pressing (ECAP) in which the average grain size of 4 and 8 passed ECAP was about 320 and 300 nm. The grain refining increased the tensile strength of ECAPed copper to 420 MPa from 210 MPa of annealed counterpart. Despite the increase in strength level, the nano-grained copper fabricated by ECAP process did not show the expected level of fatigue strength, such that the fatigue limit was similar to that of coarse grained copper at low applied stress range. In this study, the damage accumulation during fatigue was found to be accelerated in ultrafine grained copper compared to coarse grained counterpart. The damage accumulation mechanism in ultrafine grained copper was discussed based on the micrographic observation. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：S587 / S589

页数：3

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